Analysis of Velocity Field in The Interface of Copper/Aluminum Rolled Composite Process

In order to prepare copper-aluminum composites with excellent performance, based on MSC.Marc finite element simulation software, 1060 pure aluminum and TP2 pure copper to simulate the velocity field of cold rolling composite interface was selected, and the velocity change of copper-aluminum interface under different rolling parameters were studied. The change of the velocity field on the bonding interface and the interface recombination of the copper-aluminum composite strips at different thickness ratios and different degree of reduction in pass are determined. The finite element simulation analysis shows that: with the increase of the thickness ratio of the copper-aluminum composite strip, the range of the rolling speed difference required for the interface composite become larger. The analysis of the peeling test showed that: in the three cases when ratio of copper strip thickness to aluminum strip thickness was 1∶4, 1∶5, and 1∶6, the corresponding interface achieve a good composite strip at the threshold degree of reduction in pass.