Abstract: Compared with traditional lighting, LED lighting has various advantages of energy saving, small radiation, long service life, and high color rendering index, etc. In the current LED flip-chip packaging process, two methods are mainly used to mount the chip to the substrate, one is through conductive silver glue for bonding, and the other is eutectic soldering. The reliability of eutectic welding technology is higher than that of the conductive adhesives, however, there are few studies on the improvement of its performance. The current research progress of eutectic soldering of LED chips and the focus of future research were reviewed in terms of eutectic solder, eutectic soldering technology, and eutectic soldering reliability.